*Date Posted:* 2024-06-06*Country:* United States of America*Location:* CA601: Goleta (EW) Bldg H01 6380 Hollister Avenue Building H01, Goleta, CA, 93117 USA*Position Role Type:* OnsiteAt Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. The Senior Principal Firmware Design Engineer is responsible for requirements analysis and decomposition, sub-system design, modeling, simulation, and design verification test. The Sr Principal FW Design Engineer will work with other experienced engineers, will have strong written and verbal communication skills, and will have the ability to work independently yet collaboratively in a team environment. What You Will Do: This position is for an electrical engineer to work in the Hardware/Firmware Engineering Department at the Electronic Warfare Systems of Raytheon. The person hired for this position will work on new product development based on descriptions and specifications provided by our customers. This entails working in integrated product teams to design, develop, and manufacture complex state-of-the-art systems for airborne, naval, and land-based military applications. Activities include detailed digital design, embedded systems, and FPGA development. Specific tasks include circuit analysis, circuit simulation, FPGA programming, design documentation, design verification and testing, and integration of hardware and software at the level of electronic components and circuit boards. Qualifications You Must Have: Typically requires a Bachelor's degree in Electrical Engineering or related Science, Technology, Engineering or Mathematics (STEM) degree discipline and a minimum of 5 years of experience in one or more of the following areas:
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